A module, also known as a chip module, is a small unit containing an Integrated Circuit (IC) packaged onto a small substrate. Smart card modules are usually ICs attached on flexible tapes where the control of the overall thickness is important. This is because the whole module would need to be embedded into a plastic card with the size and thickness of a credit card. The smart card module is the intelligence of the smart card since it contains the IC capable of storing information and processing data like a computer. Smart card modules can be classified under two broad categories: the lower cost memory chip modules; and the more costly controller unit (MCU) modules. The module is related to the smart card as shown in the flowchart below:
Magcard is well equipped for semiconductor packaging such as the Die Attach, Wire Bonding, Encapsulation and Testing Machines. The processes are controlled to provide a smart card module that will meet the thickness requirements without causing the mechanical strength of the unites to be compromised. We can supply the modules using different tape patterns as required by the product and the customer. The processes are capable of running under tight quality controls with little supervision required. This will ensure consistent high quality parts being made with a high throughput. The modules will be 10% tested to screen out all defects before being shipped.
The die attach process is the attachment of the IC (die/chip) to the substrate. The substrate is the flexible film tape which is used for most smart card modules. It involves the dispensing of epoxy (adhesive material) onto the substrate material and picking up a die from the wafer and placing it on the epoxy. The epoxy is heated and hardened thus forming a tight bond between the die and the tape. Our die attach machines are capable of high speed and accurate placements of ICs on the substrate material.
Wire bonding creates the electrical connections between the electrical connection pads (located on the IC) and the pads located on the tape modules. The wires used for this process are either aluminium or gold. This process involves the application of pressure, heat and vibration to form the joins. At Magcard, our equipment is capable of doing lowloop bonding. The quality of the bonds are also checked to ensure high quality and reliability.
Encapsulation protects the die and the wires from being damaged. It is done by dispensing an encapsulation compound over the IC and wires. This compound is hardened by the application of the heat. Once hardened, it will prevent physical tampering of the IC. Another material commonly used for encapsulation is made from an ultra-violet (UV) curable compound. The compound is hardened by the application of UV irradiation. Magcard’s process is capable of doing high speed encapsulation for small phone card ICs and large MCU ICs.
Each module is either tested to our in-house standard or to the requirements specified by individual customers. Standard testing for smart card modules are the Open & Short Test and Answer to Reset (ATR). All rejects will have a hole punched at a specific location on the tapes as an identification mark. Card manufacturers will therefore be able to identify and discard the bad units.
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